New TVS diode arrays combine high ESD protection with smaller footprints

28-05-2015 | Littelfuse | Semiconductors

Littelfuse has introduced four new solutions for general-purpose ESD protection TVS Diode Arrays (SPA Diode) that occupy less board space than similar industry offerings.

The SP1013 and SP1014 TVS Diode Arrays fit into a standard 0201 footprint but offer a 30 percent reduction in the board space required over other 0201 outline solutions, allowing more clearance between components. The SP1020 and SP1021 Series are packaged in the industry’s smallest ESD protection footprint, a 01005 flip chip, while providing nearly 78 percent lower capacitance than similar market solutions, says the company.

All four products feature back-to-back Zener diodes to protect electronic equipment that may experience destructive electrostatic discharges (ESD). The back-to-back configuration provides symmetrical ESD protection for data or signal lines when AC signals are present. These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Applications include mobile phones, smartphones, digital cameras, wearable technology, tablets, and portable devices, says the company.

“These TVS Diode Arrays were developed in response to customers in the wireless and wearable device markets who wanted high ESD protection performance in the smallest practical footprints,” said Tim Micun, product manager for the TVS Diode Arrays line. “They provide very high levels of immunity to ESD attack and surge attack, which helps extend the useful lives of the end-products into which they’re built.”

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