Three-row 25Gbs board-to-board connector deals with more data throughput

ERNI, a leading supplier of connectors and value added services, has expanded its 1mm pitch MicroSpeed high-speed connector system to include a new three-row version. The MicroSpeed connector system features SMT terminals that provide a high contact density capable of speeds up to 25Gbps. The open pin-field design allows for a third (centre) row that can be selectively assigned as ground to optimize signal quality between the higher speed signal conductors or rows. The open pin field construction of the MicroSpeed connector can accommodate differential or single-ended signals, while maintaining maximum performance speed. The MicroSpeed straight (180 degree) connectors are ideal for board-to-board connections (mezzanine) or board connection via flex PCBs. Initially designed for board-to-board distances of 5mm (1mm male and 4mm female), effective spacing up to 6.5mm can be realized when considering a long 1.5mm wipe length. The new connectors are ideal for next-generation communication standards like Ethernet 100Gbps (IEEE 802.3ba), Optical Internetworking Forum (OIF), PCIe and USB 3.1, and more. Typical applications that benefit from the connectors are data communications and telecommunications, high-end computing, medical technology, or industrial automation with high-speed transmissions and high data volumes. "With this latest MicroSpeed variant, ERNI is answering customer requests for more data throughput without compromising electrical performance or shielding effectiveness. Improvements to the shield design further minimizes inductive coupling while the open pin array offers maximum flexibility in routing and segregating of low and high-speed signalling requirements," said Kevin N. Oursler, US director of sales and marketing. The three-row MicroSpeed high-speed connector system has a frame design with polarized mating face and self-centring during connector placement, 1.5mm wipe length, and the robust blind-mate design that provides safe and reliable usage for industrial requirements. A security measure for system integration is afforded by the generous mis-mating allowances of the unique contact design, which offers a longitudinal misalignment tolerance of +/- 0.7mm and angular misalignment tolerance of up to four degrees. In addition, the dual-beam female contact design offers high tolerance compensation and proven reliability over the life of the product. The rows of signal pins in the board-to-board configuration are shielded on the perimeter of the connector body and can be optimized for high impedance signal transmissions. The impedance-matched (50/100ohm) connectors are specified for the extended temperature range of -55C to +125C. The SMT coplanarity is fully guaranteed and specified with less than 0.1mm for all the contacts. The longitudinal pitch of 1.0mm and the row spacing of 1.5mm permit horizontal and vertical arrangements of the differential pairs or single-ended signals depending on the application and/or requirement with regard to crosstalk. Optimum crosstalk behaviour can be achieved by means of special layout configurations - with ERNI providing support in the form of field-tested suggestions. MicroSpeed connectors are capable of 500+ mating cycles and accommodates extended temperature ranges of -55C to +125C The current-carrying capacity is 1A for the signal contacts and 10A for the shielding. The connectors are available with 75 and 192 pins (3 x 25 and 3 x 64), and additional pin numbers can be offered upon request, says the company.