High-density LGA solderless open-field vertical compression connectors

28-04-2015 | Astute Electronics | Connectors, Switches & EMECH

Astute Electronics is stocking Airborn Electronics' new RZ Series of high-density LGA solderless open-field connectors. The RZ Series features a patented Z-axis contact system and is designed to be compressed under pressure between parallel PCBs or between the PCB and other electronic components. The vertical surface-mount PCB compression connectors are ultra-reliable, due to their one-piece contact system. The RZ Series has beryllium copper contacts with gold over nickel finish at 1.27mm spacing, and is available in contact sizes 20 - 175 (2 - 7 rows and 10 - 25 columns). Available heights are 2.54mm to 8.89mm. Electrical characteristics include current rating of 0.5A and typical contact resistance of 25mohm, depending on contact height. Insulation resistance is 5000Mohm minimum at 100VDC.

By Craig Dyball