High-density LGA solderless open-field vertical compression connectors
Connectors, Switches & EMECH
Astute Electronics is stocking Airborn Electronics' new RZ Series of
high-density LGA solderless open-field connectors. The RZ Series features a
patented Z-axis contact system and is designed to be compressed under
pressure between parallel PCBs or between the PCB and other electronic
components. The vertical surface-mount PCB compression connectors are
ultra-reliable, due to their one-piece contact system.
The RZ Series has beryllium copper contacts with gold over nickel finish at
1.27mm spacing, and is available in contact sizes 20 - 175 (2 - 7 rows and
10 - 25 columns). Available heights are 2.54mm to 8.89mm. Electrical
characteristics include current rating of 0.5A and typical contact
resistance of 25mohm, depending on contact height. Insulation resistance is
5000Mohm minimum at 100VDC.