First 0603 / 0805 QPL RF chip inductors with tin / lead solder terminations

19-01-2015 | Gowanda | Passives

Gowanda Electronics recently achieved qualification to the military MIL-PRF-83446 specification for its MLRF0603 and MLRF0805 series of RF surface mount wirewound coil, ceramic core chip inductors with tin / lead terminations. These are the first series in the industry to attain Qualified Product List (QPL) status for this particular Department of Defense specification, says the company. Tin / lead solder terminations are necessary for processes where reflow soldering is the component assembly method. In such situations, gold terminations require additional processing to pre-tin the terminations prior to assembly in order to prevent gold embrittlement. The tin/lead terminated QPL inductors now available from Gowanda provide an effective time-saving, solder-friendly solution. The MLRF0603 and MLRF0805 series are designed for demanding RF applications in defence and aerospace communities. This includes use in communication, guidance and security applications, as well as in radar, test and evaluation and special mission applications. These series can also be used in other high frequency applications around the world where the rigorous testing associated with these QPL-approved inductors makes them desirable for high reliability (hi rel) designs, or wherever QPL-approval provides additional assurance of performance and reliability. MLRF0603 is QPL approved to MIL-PRF-83446/36B (with amendment 1 dated April 4, 2014) and provides inductance from 1.8 to 270 nH, Q Min from 16 to 40, SRF MHz min from 600 to 6000, DCR Ohms max from 0.07 to 1.78 and current rating DC mA from 195 to 1000. MLRF0805 is qualified to MIL-PRF-83446/37A (with amendment 1 dated April 4, 2014) and provides inductance from 2.2 to 2200nH, Q Min from 15 to 65, SRF MHz min from 40 to 6000, DCR Ohms max from 0.08 to 5.0 and Current Rating DC mA from 140 to 1000, says the company.
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By Craig Dyball