Octavo Systems Unveils Miniature AM6254 SiP at Embedded World 2025

At Embedded World 2025, Electropages stopped by Octavo Systems to explore their latest innovation in System-in-Package (SiP) technology — a compact module integrating the TI AM6254 processor and 1GB DDR4 in a DDR-sized 9mm x 14mm BGA package. 

CTO Erik Welsh walks us through how Octavo Systems is pushing the limits of integration with advanced die stacking, enabling embedded engineers to deploy quad-core processing and high-speed memory in ultra-compact applications like drones, smart buildings, edge servers, and even parallel computing clusters. 

With options to choose between full integration (including power management) and flexible configurations for niche applications, Octavo offers tailored solutions backed by comprehensive developer support.