07-08-2025 | Teradyne Limited | Test & Measurement
Teradyne, Inc. has launched the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices, integrated with GPUs and accelerators in high-performance, generative AI servers. The tester is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale.
"We are thrilled to introduce the Magnum 7H, a revolutionary memory tester that sets a new standard for testing HBM devices," said Young Kim, president, Memory Test Division, Teradyne. "This innovation represents a significant milestone in our commitment to advancing memory test technology and delivering a tester that not only supports today's devices but is future-proofed for tomorrow's devices as well."
The device is a cutting-edge memory tester that supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It provides comprehensive test coverage, from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Also, it supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with conventional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality.
The Teradyne Magnum 7H delivers:
The growing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne's Magnum 7H is a next-generation memory tester engineered to test today and tomorrow's HBM devices with high parallelism, speed, and accuracy, across the whole manufacturing process.