Bluetooth LE module for efficient wireless connectivity

07-03-2024 | Mouser Electronics | Semiconductors

Mouser now stocks the CYW20822 AIROC Bluetooth LE module from Infineon Technologies. The compact CYW20822 module offers seamless integration and enhanced performance with Bluetooth LE-LR support. With the right low-power and high-performance combination, the module delivers a cost-optimised wireless connectivity solution to support the complete spectrum of Bluetooth LE-LR use cases, including IIoT applications, smart home, asset tracking, beacons, sensors, and medical devices.

The module simplifies the development of wireless capabilities in electronic products, providing reliable performance with minimal additional components. The self-contained solution features an onboard crystal oscillator, passive components, flash memory, and the silicon device. The device supports peripheral ADC and PWM tasks, UART, I2C, and SPI communication, and a PDM interface for various connectivity and control options. The module comprises a royalty-free Bluetooth stack compatible with the Bluetooth core specification 5.0. The module is housed in a 20.2mm × 10.5mm × 2.3mm package, making it an excellent option for small electronic devices.

The device is offered in two certified versions: the CYW20822-P4TAI040, which includes an integrated trace antenna, and the CYW20822-P4EPI040, which supports an external antenna via an RF solder pad output. Both variants are fully certified, eradicating the time needed for design and certification processes and accelerating product development.

The CYW20822 is supported by the Infineon Technologies AIROC CYW920822M2P4TAI040-EVK evaluation kit, which is also available from Mouser.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.