ROHM has created a compact, high-efficiency 20V Nch MOSFET, RA1C030LD, optimised for switching in small, thin devices, incorporating smartphones and wearables, including wireless earbuds and other hearable equipment.
The development of MOSFETs in wafer-level chip-size packages (WLCSP) contributes to greater miniaturisation while keeping the required characteristics and is becoming mainstream in the industry. The company uses its strengths as an IC manufacturer to greatly decrease wiring resistance (which has increased with conventional discrete processes). The result is a compact power MOSFET that provides low power loss.
The RA1C030LD is provided in the DSN1006-3 wafer-level, chip-size package (1mm × 0.6mm) that takes advantage of the company's proprietary IC process to provide low power dissipation and greater miniaturisation. In terms of the FOM that describes the relationship between conduction and switching losses (ON-resistance × Qgd), an industry-leading value has been produced that is 20% lower than standard package products in the same package (1mm × 0.6mm or smaller), adding to a particularly smaller board area together with higher efficiency in a variety of compact devices. At the same time, its unique package structure offers insulated protection for the side walls (unlike standard products in the same package with no protection). This lowers the risk of shorts due to contact between components in compact devices that has to resort to high-density mounting due to space constraints, contributing to safer operation.
Typical application examples include hearables (i.e. wireless earbuds); wearables such as smart glasses, smart watches, and action cameras; smartphones; and also ideal for switching in a wide range of thin and compact devices.