23-08-2022 | IDTechEx | Subs & Systems
In this webinar, Dr Yu-Han Chang will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, including research from IDTechEx's latest market research study, "Advanced Semiconductor Packaging 2023-2033". This webinar takes place on Thursday 25 August 2022 for 30 minutes.
Data is bursting at every level and in nearly every industry. ML and AI are essential data enablers in many applications, including data centres, 5G, and autonomous cars. A powerful processor is required to run these programmes, with an IC made on Si serving as the basis.
For decades, IC design house would create a chip with all functionalities incorporated on a single die; however, as Moore's law slows (chip density are no longer doubling every two years), scaling monolithic IC becomes increasingly complex and costly. This forces IC manufacturers to follow "advanced semiconductor packaging technologies". Compared to traditional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, pledges higher chip connection and lower power consumption, allowing the IC vendor to continue supplying high-performance chips at a reasonable price.
This webinar will offer an overview of the current state of the advanced semiconductor packaging industry, including analysis of advanced semiconductor packaging markets and their mid-long-term opportunity; key applications' growth drivers; player analysis - the dynamics of advanced semiconductor packaging battleground; and advanced semiconductor packaging technologies - current challenges and innovative trends.
