NXP Semiconductors has released its WLAN7207H 2.4GHz FEIC providing Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone. The WLAN7207x single FEM family offers routing and PCB design flexibility that allows optimised RF performance in a smartphone.
The single FEM family provides designers extra freedom in routing and placement on the PCB, enabling RF optimisation supporting higher Wi-Fi 6 and Bluetooth performance.
“As consumers continue to rely on their smartphones for an ever-increasing list of data-driven benefits, Wi-Fi 6 addresses the need to move a rapidly expanding amount of data across more devices,” said Doeco Terpstra, vice president and general manager Smart Antenna Solutions, NXP. “Our FEIC solutions enable the Wi-Fi 6 performance benefits that consumers want while offering the design flexibility that OEMs need.”
“As smartphones have become more feature-rich, form-factor has become a differentiating feature for consumers,” said George Zhao, CEO of Honor. “NXP’s FEM solution enabled us to overcome the increasing complexity and challenges presented by our flagship phone designs, while still offering the longer transmission range and improved signal quality consumers associate with Wi-Fi 6.”