New automotive-qualified MLV with competitively low clamping-to-working-voltage ratios

11-10-2019 | AVX Limited | Passives

AVX has a new series of automotive-qualified multilayer varistors (MLVs) specially created to display lower- and clamping-voltage to working-voltage ratios than other standard varistors. Constructed of zinc-oxide-based (ZnO-based) ceramic semiconductor devices with nonlinear, bidirectional voltage-current (V-I) characteristics similar to those of back-to-back Zener diodes, but with better current and energy handling abilities and the addition of EMI/RFI attenuation, the new VLAS Series Low-Clamp TransGuard Automotive MLVs combine bi-directional overvoltage circuit protection and broadband EMI/RFI filtering functions in a single, space-saving, SMT device that is qualified to AEC-Q200, proven to deliver high-reliability performance, and able to achieve very low clamping-to-working-voltage ratios that were previously only achievable with TVS diodes. This enables the new series MLVs to extend the multifunctional advantages of varistor technology to sensitive industrial, automotive, and general electronics applications that need tighter clamping voltage performance for improved overvoltage protection, as well as the extreme optimization of physical space, including infotainment systems, ECUs, MCUs, and displays.

"AVX's new VLAS Series Low-Clamp TransGuard Automotive Multilayer Varistors extend the multifunctional, space-saving, and high-reliability performance advantages of varistor technology to applications that require very tight clamping-to-working-voltage ratios, including automotive and industrial systems that need to be protected from overvoltage in order to prevent damage and downtime and to ensure the safety of operators and passengers," said Jiri Machanicek, product marketing manager for circuit protection at AVX. "

The new MLVs give TVS protection in their on-state and broadband EMI/RFI filtering in their off-state, don't need any current or energy derating over the complete rated operating temperature range, and provide a compact form factor that provides increasingly common cross-market needs for lightweight, space-saving components.

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