Thermal cooling configuration provides next-generation solutions

21-05-2019 | Molex | Subs & Systems

Molex highlights its new BiPass thermal management configuration cooling QSFP-DD modules up to 20W with a 15C change from the ambient temperature. The thermal solution can cool a range of 15W to 20W in various configurations. The solution enables higher wattage modules to be cooled and will help designers on the path toward 112Gbps.


As the industry is preparing for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are crucial. Running at 15W, all configurations were able to cool at less than 25C delta T rise. The solution routes high-speed signals through Temp-Flex twinax cables allowing greater channel margin opposed to PCB alone. It provides for a second heat sink on the base side of the cage to make contact with the module, giving additional cooling.


“If you need to be able to cool a 15W module, there are a number of different solutions available today,” said Chris Kapuscinski, global product manager, Molex. “We now have the ability to cool higher wattage modules. The BiPass solution has the opportunity to save designers money as well as be a key enabler as we move forward with 112 Gbps PAM-4 implementations.”


“As demand for faster data rates grow, data center technology is evolving quickly, and thermal management technology must keep up. The BiPass solution allows for better temperature control of a system using advanced materials, the latest tools and cutting-edge technologies without compromising performance,” adds Kapuscinski.

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