Lowest-profile 5A power module for telecom, industrial and SSD applications

A new integrated switching power module designed specifically for height-constrained telecom, industrial and solid-state drive (SSD) applications, the MIC45404 has been unveiled by Microchip. The unit is housed in a thermally-enhanced package that incorporates inductors and passive components into a single, moulded power converter. The slim 10mm x 6mm x 2mm package saves space, simplifies board design, and eliminates concerns over passive components that may introduce unexpected electromagnetic interference (EMI). According to IHS, the global power-module market is projected to comprise nearly one third (30 percent) of the power semiconductor market by 2019, growing at twice the rate of power discretes (from 2014 to 2019). Microchip is well-positioned in this market, in part because it has developed a process that puts all passives on a thermally-enhanced lead-frame that reduces the distance between the components, which minimises radiated emissions and improves thermal dissipation. The MIC45404 incorporates one of the thinnest integrated magnetic inductors available in a 19V, 5A point-of-load buck converter. Integrated components include the controller, metal-oxide semiconductor field-effect transistors (MOSFETs), feedback path, and pulse width modulation (PWM) switching regulator. The low profile of the MIC45404 module allows it to be placed on the back of a PCB, on a daughter card, or other placement where vertical height may be constrained in point-of-load power conversion, telecom and industrial applications. The MIC45404 is available today for sampling and volume production in a 10mm x 2mm x 6mm QFN package. Pin-selectable output voltages, switching frequencies, and current limits provide further design flexibility and space savings, says the company. The company also introduced the MIC45404 Evaluation Kit (MIC45404YMP-EV) which enables application development with the integrated switching power module.