Ultra-compact Bluetooth Smart module from stock

28-05-2015 | Mouser Electronics | Subs & Systems

Mouser is now stocking the SESUB-PAN-T2541 Bluetooth v4.0 Module from TDK. This ultra-compact, Bluetooth 4.0 Low Energy (LE) micro module is one of the world's smallest modules for Bluetooth Smart devices, says the company. The SESUB-PAN-T2541 is based on TDK's proprietary Semiconductor Embedded in Substrate (SESUB) technology, resulting in a size much smaller than modules using discrete components. Power consumption is about 25 percent less than classic Bluetooth devices. The module offers easy implementation of Bluetooth connectivity by simply connecting a power supply, microcontroller interface, and antenna. A Texas Instruments CC2541 Bluetooth SoC die is mounted onto a thin substrate, along with all peripheral circuitry including a 32MHz crystal, bandpass filter, and capacitors. This results in a module about 65 percent smaller most competitive solutions. All I/Os from the substrate layers are also routed to a ball grid array (BGA) footprint on the module's bottom surface. Interfaces include UART, SPI, I2C, and I/O. All this functionality helps to speed the hardware design process, allowing fast and easy implementation of Bluetooth connectivity. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics. The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module targets low-power, wireless applications, including consumer applications as well as wireless sensors, cable replacement applications, instrumentation, heart rate monitors, and blood glucose meters. Other applications include Internet of Things and wearable devices.
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By Craig Dyball