Ultra-compact Bluetooth Smart module from stock
Subs & Systems
Mouser is now stocking the SESUB-PAN-T2541 Bluetooth v4.0 Module from TDK.
This ultra-compact, Bluetooth 4.0 Low Energy (LE) micro module is one of the
world's smallest modules for Bluetooth Smart devices, says the company.
The SESUB-PAN-T2541 is based on TDK's proprietary Semiconductor Embedded in
Substrate (SESUB) technology, resulting in a size much smaller than modules
using discrete components. Power consumption is about 25 percent less than
classic Bluetooth devices. The module offers easy implementation of
Bluetooth connectivity by simply connecting a power supply, microcontroller
interface, and antenna.
A Texas Instruments CC2541 Bluetooth SoC die is mounted onto a thin
substrate, along with all peripheral circuitry including a 32MHz crystal,
bandpass filter, and capacitors. This results in a module about 65 percent
smaller most competitive solutions. All I/Os from the substrate layers are
also routed to a ball grid array (BGA) footprint on the module's bottom
surface. Interfaces include UART, SPI, I2C, and I/O. All this functionality
helps to speed the hardware design process, allowing fast and easy
implementation of Bluetooth connectivity. Output power is rated at 0 dBm
(typ.), with a communication range of 10 meters, depending on line of sight
and antenna characteristics.
The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module targets low-power, wireless
applications, including consumer applications as well as wireless sensors,
cable replacement applications, instrumentation, heart rate monitors, and
blood glucose meters. Other applications include Internet of Things and