Ultra-compact Bluetooth Smart module from stock

28-05-2015 | Mouser Electronics | Subs & Systems

Mouser is now stocking the SESUB-PAN-T2541 Bluetooth v4.0 Module from TDK. This ultra-compact, Bluetooth 4.0 Low Energy (LE) micro module is one of the world's smallest modules for Bluetooth Smart devices, says the company. The SESUB-PAN-T2541 is based on TDK's proprietary Semiconductor Embedded in Substrate (SESUB) technology, resulting in a size much smaller than modules using discrete components. Power consumption is about 25 percent less than classic Bluetooth devices. The module offers easy implementation of Bluetooth connectivity by simply connecting a power supply, microcontroller interface, and antenna. A Texas Instruments CC2541 Bluetooth SoC die is mounted onto a thin substrate, along with all peripheral circuitry including a 32MHz crystal, bandpass filter, and capacitors. This results in a module about 65 percent smaller most competitive solutions. All I/Os from the substrate layers are also routed to a ball grid array (BGA) footprint on the module's bottom surface. Interfaces include UART, SPI, I2C, and I/O. All this functionality helps to speed the hardware design process, allowing fast and easy implementation of Bluetooth connectivity. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics. The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module targets low-power, wireless applications, including consumer applications as well as wireless sensors, cable replacement applications, instrumentation, heart rate monitors, and blood glucose meters. Other applications include Internet of Things and wearable devices.

By Craig Dyball