Metallic foam heat sinks perform well in low-profile applications

Offering high thermal performance for low-profile applications, Versarien low-profile metallic foam heat sinks are now available from Mouser stock. The heat sinks use VersarienCu micro-porous metallic copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the high thermal conductivity of copper allow for the height of the heat sinks to be reduced without sacrificing performance. A thin, hard layer of high-temperature copper oxide improves the emissivity of the foam, boosting the radiant properties of the heat sink and reducing the temperature of the component. The heat sinks are designed for use in passive cooling applications where space is at a premium and performance is crucial such as power ICs, high-temperature components, transistors, cable modems, broadband, VOIP and LED TVs.