New stacking connectors for board to board and flex to board applications

09-01-2019 | Cinch | Connectors, Switches & EMECH

Cinch Connectivity Solutions, a Bel group company, has released its CIN::APSE stacking connector series.

The connectors are solderless, high density, stacking interconnects are used for flex to board, board to board, and component to board applications. The connectors are found in applications where a mezzanine style PCB layout is used to lessen space and weight. The connector's 1mm pitch accommodates high-density circuits between boards. The connectors' mechanical contacts are tough for applications that demand several cycles of disconnections for modifications or testing. The mechanical contacts also lessen the requirement for soldering and subsequent inspection.

The connector is claimed to be one the most widely implemented solderless, high speed interconnects in the industry. With a flight-proven history, these stacking connectors are found on defence, aerospace and satellite applications globally.

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