Multi-chip package ideal for space-constrained and cost-optimized embedded designs

25-08-2017 | Mouser Electronics | Semiconductors

Mouser is now stocking the S71KL512SC0 HyperFlash and HyperRAM MCP from Cypress Semiconductor. This memory subsystem solution combines high-speed NOR flash memory for fast-boot and instant-on with a self-refresh DRAM for expanded scratchpad memory — all in a reduced footprint, low-pin-count package that is ideal for space-constrained and cost-optimized embedded designs.

The MCP is based on the company’s HyperBus interface, which enables faster systems with quicker response times and a richer user experience. The device features 512Mbits of HyperFlash and 64Mbits of HyperRAM, and is the optimum multi-package solution for designers looking to get a full high-performance memory subsystem with 70% fewer pins and a 77% smaller footprint compared to existing SDRAM and Quad SPI solutions.

The device is housed in a 24-ball, FBGA package that shares a common footprint with discrete HyperFlash and HyperRAM products. The single-pad layout and common footprint enables engineers to support either a discrete device or the HyperFlash and HyperRAM MCP, offering the flexibility to change the design at any point in the product lifecycle without affecting the overall board layout, which saves valuable development time and minimizes cost.

The device is aimed at communications equipment, industrial applications and other high-performance IoT products.

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