New nano-pitch I/O 80-circuit interconnect system offers highest port density

08-04-2016 | Molex | Connectors, Switches & EMECH

Molex has introduced the Nano-Pitch I/O 80-circuit interconnect system, which offers the highest port density (number of high-speed differential lanes) and speed (25Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCI express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise, says the company. “With an industry-leading port density, multi-protocol application support, and enhanced signal integrity, the Nano-Pitch I/O 80-Circuit Interconnect System is redefining PCIe and SAS solutions within the storage industry,” said Joe Dambach, product manager, Molex. The system’s flexible pinout concept (continuous Ground-Signal-Signal-Ground) optimises it for high-speed applications and maximises the number of high-speed lanes within the lengths provided. Eight lanes (80 circuit) are available, per industry standard. The system’s small form factor (5mm x 23mm x 9mm) and a 12mm mated connector-to-cable assembly height, for right-angle cable exit, allow it to service mobile devices through enterprise applications. Staggered, reliable and constant dual-row contact configuration makes it hot pluggable (the ability to add components without shutting down the system). Also, the connector provides optimal routing for high-speed trace connections while reducing the need for PCB real-estate. Storage systems applications include data centre and enterprise storage systems, storage racks, JBODs, storage controllers, HBA servers, and RAIDS. Telecommunications/networking applications for the connector include hubs, servers, switches, and routers.
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By Electropages Admin