Ultra low-profile high-density interposers provide ultimate design flexibility

19-03-2015 | Samtec | Connectors, Switches & EMECH

Samtec’s newly released Z-Ray one-piece interposer arrays are ultra-low profile, high density and highly customizable. The compression contact arrays are used as interposers or integrated into connector housings. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance.

The 0.8mm pitch ZA8 Series arrays are available with a choice of dual compression contacts or single compression with solder balls. With up to 400 total BeCu micro-formed contacts, they feature low 25g normal force with 0.2mm contact deflection.

Z-Ray is a one piece design assembled into rugged low profile single layer FR4 substrate under high pressure and temperature to achieve a 1.00 mm stack height. Screw down and alignment holes are standard for use with press fit alignment hardware for a secure connection without over compression between the PCB boards. A 34 AWG twinax cable on 0.80 mm pitch with 8 and 16 pairs standard is in development.

A variety of custom capabilities is available including the overall shape of the interposer, multiple pitches as low as 0.65mm, greater density of up to 1,200 contacts per square inch in any pattern and stack heights from 0.50 mm to 4 mm. Construction of the interposer is customizable with multi-layer FR4, for example: pitch spreaders and other embedded interconnect circuitry. Design flexibility also includes features such as latches, thermal spreaders and quick-release spring constraints for more rugged applications. Quick-turn customizations are available and require minimal NRE and tooling, says the company.

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