Backplane interconnect system delivers 40Gbps performance

12-02-2015 | Mouser Electronics | Connectors, Switches & EMECH

Mouser is now stocking the Impel Backplane Interconnect System from Molex.
Delivering industry-leading low cross-talk and high-density performance for
next-generation backplane interconnect solutions, the system offers a
migration path for enhancements in the same chassis through Impel
daughtercard options, providing data rates as fast as 40Gbps. This enables
developers to migrate to faster data rates without a redesign while meeting
industry mechanical density requirements.

The Molex Impel Backplane Interconnect System, available from Mouser
Electronics, provides a scalable price-for-performance solution, enabling
high-speed data rates from 25 to 40Gbps using compact backplane and
daughtercard connectors. The Impel conventional connector orientation, with
a right angle daughtercard mating to a vertical header, provides 3 to 6 pair
options to support optimal price and performance. The 1.90mm conventional
solution supports 80 differential pairs per linear inch. In this same
configuration, the Impel connector system enables co-planar solutions, which
supports right angle daughtercard mating to right angle headers for added
scalability. For orthogonal architectures, the Impel backplane connector
system allows for 3 to 6 pair configurations, scaling from 18 to 72
differential pairs per node.

The skew-less design of Molex's Impel Backplane Interconnect System includes
a staggered header-pin interface for robust mechanical isolation from the
signal pins. All connectors provide end-to-end channel performance, with
compliance in both the Optical Internetworking Forum (OIF) Stat Eye and IEEE

Molex's Impel Backplane Interconnect System are ideal for a variety of
aerospace and defence, data communications, industrial, telecommunications
and data networking applications, says the company.

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