An increase in the use of resin encapsulation as a quick, simple and
cost-effective method of protecting against shock, vibration, moisture
ingress and intellectual property theft, is being experienced by contract
manufacturer, Wilson Process Systems (WPS). Also, the company has developed
a low-cost production method of permanently incorporating company or product
names into the finished encapsulated product without resorting to expensive
moulds.
Electronic systems are increasingly being asked to perform in the open air,
exposed to all weather conditions. Products are also now expected to
withstand a level of rough-handling as systems become pervasive in every
aspect of our daily life. Encapsulation provides a quick a and inexpensive
means of ruggedising equipment for use in such conditions. More,
encapsulation makes it harder for competitors to reverse-engineer a product
design, offering a degree of protection against IP theft, says the company.
Nick Jones, sales director, WPS, said: "We have developed a very flexible
and cost-effective encapsulation process which offers our customers all the
usual benefits of encapsulation, plus the ability to have a logo, company or
product name included in the encapsulation housing without the need for
costly moulds. It's not rocket science, but it does illustrate one of the
strengths of our company; we listen to our customers and try to find
practical, affordable approaches which address their requirements without
calling for radical redesigns."
