MCU with BLE 5.2 for industrial and wearables delivers ease of connectivity

11-04-2024 | Mouser Electronics | Semiconductors

Mouser now stocks the MAX32690 MCU from Analog Devices, Inc. Combining all the necessary processing horsepower with the ease of connectivity and Bluetooth needed for various consumer and industrial IoT applications, the device is an ideal ultra-efficient MCU for battery-powered applications presented in an advanced SoC offering.

The ADI MAX32690 MCU, available from Mouser Electronics, features a 120 MHz Arm Cortex-M4F CPU with a FPU for arithmetic calculations and instructions, along with an ultra-low-power, 32-bit RISC-V (RV32) coprocessor to help in offloading data processing. The SoC, equipped with multiple low-power oscillators, offers external crystal support (32MHz required for Bluetooth LE) and provides 3MB of internal Flash and 1MB of internal SRAM, with external Flash and SRAM expansion interfaces also available. The robust offering of on-chip communication interfaces has multiple QSPI, UART, CAN 2.0B and I2C serial high-speed interfaces, plus one I2S port for connecting to an audio codec. All interfaces enable efficient DMA-driven transfers between the peripheral and memory, and a 12-input (8x external), 12-bit SAR ADC samples analog data at up to 1 megasamples per second (Msps).

The device's Bluetooth 5.2 low energy (LE) radio supports multiple modes, including mesh, long-range (coded), and high-throughput, with the device's RISC-V core freeing up the programmer from BLE interrupt latency concerns by handling timing-critical controller tasks. LE Audio hardware implemented with the software codec is provided separately. For IP data/security concerns, the MAX32690 offers a Cryptographic Toolbox (CTB) that features a modular arithmetic accelerator (MAA) for quick elliptic curve digital signature algorithm (ECDSA), an advanced encryption standard (AES) engine, TRNG, SHA-256 hash and secure boot loader. Two quad-SPI execute-in-place (SPIXF and SPIXR) interfaces (up to 512MB each) are also included to expand internal code and SRAM space off-chip.

The MCU is available in a 68-lead TQFN-EP (0.4mm pitch) package and a 140-bump WLP (0.35mm pitch) package. The device is suitable for industrial environments and is specified at a temperature range of -40C to +105C. Target applications include wired and wireless industrial communications, wearable and hearable fitness and health devices, wearable wireless medical devices, IoT and IIoT, and asset tracking. The device is supported by an evaluation kit (MAX32690EVKIT#), also available on the Mouser website.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.