Fast-cure conductive adhesive for small to medium size chip bonding

Engineered Materials Systems (EMS) has unveiled its new EMS 561-338 fast-cure conductive adhesive for die attach applications with small to medium size die. The product is designed to cure in less than one minute at 150C. The adhesive is stress-absorbing to withstand the rigours of thermal cycling and features high conductive stability. The material can be applied by stencil printing or needle dispensing.