Low-temperature cure conductive adhesive for EMI/RFI shielding and more

Engineered Materials Systems (EMS) has introduced a new low-temperature cure one-part conductive adhesive designed for circuit assembly applications. The EMS 618-116 adhesive is designed to cure in 30 minutes at 100C, or rapidly at elevated temperatures to form high-strength, high-reliability conductive interconnects in areas such as static drain and EMI/RFI shielding applications.