Ultra-compact Bluetooth low energy modules on a tiny 4.6mm x 5.6m x 1mm footprint

The TDK SESUB-PAN-T2541 Bluetooth v4.0 module is now available from Mouser stock. The ultra-compact Bluetooth low energy modules offer a tiny 4.6m x 5.6mm x 1mm footprint. The module is based on proprietary semiconductor embedded in substrate (SESUB) technology. The Bluetooth die is embedded into a thin substrate along with a quartz resonator, bandpass filter, and capacitors. The module needs only a power supply and antenna. The Bluetooth v4.0 LE specifications significantly reduce power consumption of battery powered devices, and are ideal for wireless healthcare, sport, fitness, home entertainment, and wearable devices, says the company.