High-temperature-resistant encapsulant for electronic components

04-03-2019 | DELO | Subs & Systems

DELO has created an encapsulant with very high resistance to media and temperature. Thanks to an optimised curing time, their MONOPOX GE6515 also expedites production processes. The product is especially well suited for encapsulating electronic components in automotive applications.

The product is a one-component, purely heat-curing epoxy resin. The encapsulant reaches very high strength even at high temperatures. It displays strength values of 20MPa on aluminium at a temperature of 150C and 14MPa in the upper service temperature range of 200C.

Created primarily for encapsulating electronic components, the product also delivers excellent adhesion on materials such as FR4, FA, and copper. Also, the epoxy resin is highly resistant to chemicals such as acids, oils, or fuels.

The encapsulant has a CTE matching that of materials commonly used in the automotive industry. The CTE is 23ppm/K up to the glass transition temperature (Tg) of 155C and 48ppm/K above Tg. A small CTE is particularly important for applications where temperature-induced warpage has to be avoided.

The encapsulant cures in an air convection oven at temperatures ranging from 90C to 150C. At 130C, the epoxy resin is fully cured after just 15 minutes, making production processes faster.

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