Bluetooth 5 IC is a highly expandable and integrated device

02-11-2018 | Toshiba | Automotive Technologies

Toshiba Electronics Europe has a new Bluetooth IC for automotive applications. The TC35681IFTG is based on an Arm Cortex-M0 CPU and is compliant with Bluetooth LE core specification 5.0. It will be used in multiple automotive applications including RKE, OBD and TPMS, all of which improve comfort and safety.

The mixed-signal device contains both analog RF and baseband digital parts to give a complete solution in a single QFN40 ‘wettable flank’ package measuring just 6mm x 6mm. Intended for compliance with AEC-Q100, the low energy IC is essentially intended to be used in automotive applications. The wettable flank package simplifies automatic visual inspection needed to guarantee delivery of the high levels of soldering quality required to withstand vibration encountered in automotive applications.

The device is ideal for use in harsh automotive environments due to the wide operating temperature range of -40C to +125C as well as the high RF transmission power and excellent RF reception sensitivity. The device operates from a single 1.8V to 3.6V supply, drawing just 50nA in deep sleep mode. An on-chip DC-DC converter adjusts the external voltage supply to the required values. When transmitting, the current draw is only 11.0mA, and this reduces to 5.1mA when receiving.

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