New gate driver photocoupler housed in a low-profile SO8L package

Toshiba Electronics Europe has launched a new gate driver photocoupler housed in a low-profile SO8L package. The TLP5832 delivers 2.5A peak output current (IOPS, IOPL) and can directly drive medium-class IGBTs and MOSFETs in applications such as inverters for industrial, air conditioning and solar applications as well as servo amplifiers. Adoption of the SO8L package delivers a device, that is only 2.3mm high. This is approximately 54% lower than the company's current products that are available in SDIP6 and DIP8 packages. The SO8L package gives support for modern applications where there is frequently limited mounting height and limited space. Despite its small size, the IC provides an isolation voltage (BVS) of 5000Vrms and guarantees creepage and clearance distances of minimum 8mm, which make it suitable for applications demanding high insulation performance, including safety-critical designs. Also, the new device guarantees the propagation delay time (tPLH, tPHL) to be 200ns and the propagation delay skew (tPsk) to be ±80ns right across the full operating temperature range of -40C to +110C. The result is high-efficiency inverter circuits which can be designed by reducing temperature-related design margins.