Rugged connectors deliver high-performance in extreme applications

TE's Mezalok, MULTIGIG RT 2-R, CeeLok FAS-T and Fortis Zd Series high-performance interconnects are now available from TTI Europe providing high-speed, reliable and lightweight, robust solutions in harsh environments such as defence, aerospace and space applications. Mezalok surface-mount connectors are designed for stacking or mezzanine applications and ensure high-speed 5GHz+ data rates in the most adverse environmental conditions. Available with 60 or 114 contact positions, this connector features a four-point Mini-Box contact system based on the VITA 61 standard for ultra-reliability. The 114 position interconnect is designed to support VITA 61 XMC architecture as a rugged alternative to VITA 42 XMC, while the 60 position model is specifically designed for custom architecture stacking applications. Physical characteristics include LCP plastic housing for superior thermal stability and low-outgassing. Mezalok connectors can withstand 500 mating cycles and operate in temperatures from -65C to +125C. The MULTIGIG RT 2-R is a ruggedised, lightweight high speed board-to-board modular interconnect system. VITA 46 compliant for Open VPX applications, it supports Ethernet, Fibre Channel and InfiniBand, plus PCIe and Serial Rapid I/O high-speed protocols for differential, single-ended and power signals. Designed for embedded computing applications, MULTIGIG RT 2-R interconnects are resistant to high levels of shock and vibration due to their quad-redundant contact system and robust pinless interface. CeeLok FAS-T is one of the smallest, most rugged 10GB Ethernet, field-terminable I/O connector available for the aerospace, defence and marine market, saving both space and weight due to its size 8 shell. CeeLok FAS-T interconnects have crimp snap, 39029-style contacts for easy termination and field repairability, a scoop-proof design and a robust coupling ring mechanism. Backshells are integrated into the plug body for low profile, low cost and low weight strain relief and EMI protection. Electroless nickel and black zinc nickel plating options support soldier systems, in-flight entertainment, avionics and communications systems applications. TE's Fortis Zd is a modular backplane connector system which combines a high-performance mil/aero specification with commercial technologies in a user-configurable platform. Fortis Zd connectors offer the increased electrical performance and extreme mechanical robustness for 10+ GB data rate applications. Physical characteristics include an M55302 Mini-Box separable interface that provides four points of contact on all sides of the pin and a staggered daughtercard pin field on the backplane for ESD protection, assuring reliability and durability. The Fortis ZD interconnect system is versatile with standard, shielded and rugged machined metal shell types available, and 3-pair and 2-pair versions that accommodate multiple slot pitches. Applications include fighter jets and other severe mechanical environment applications such as space vehicles, says the company.