Low-profile right-angle solder option for wires exiting a PCB with space constraints

Molex has announced that its SolderRight Direct Solder terminals are now available to fulfil direct solder wire-to-board designs where a very low-profile right-angle solder option for wires exiting a PCB is necessary due to severe space constraints. The robust solder terminal enables a secure and reliable connection with a minimal 'Z' profile. "The most common problem found in products that require a direct solder wire termination is that wires become over stressed from being bent at a 90 degree angle after soldering, resulting in long term reliability concerns. By replacing the soldering process with a direct board-in crimp terminal, this problem is eliminated," said Michael Bean, global product manager, Molex. In addition to a very low profile, the SolderRight one-piece crimp solder terminal includes unique design features such as multiple terminal and wire sizes, solder pins positioned between insulation and conductor crimps, and twin solder pins. Terminal wire sizes range from 14 to 28 AWG enabling both signal and power current capability while optimising PCB space. Solder pins positioned between insulation and conductor crimps offer superior wire strain relief and resist terminal and solder join breakage. Molex twin solder pins provide stability for solder processing and allow redundant current paths. "There is an industry need for very low-profile packaging and wire termination that simplifies the connection process and increases reliability all while saving both cost and space. Molex SolderRight Direct Solder Terminals deliver meaningful value to our customers on all fronts," added Bean.