Packaged in the thermally-efficient and compact SOT23 flat package, the ZXMS6004FF takes 85% less board space than incumbent 7.3mm x 6.7mm footprint SOT223 packaged parts.
The SOT23 flat package shares the same footprint, of just 7.5mm², as the industry standard SOT23, but due to its wider body it has a superior thermal performance enabling the ZXMS6004FF to deliver a package power density three times that of SOT223 and a footprint that is six times smaller. The size, and hence the cost, of the end application can be reduced if current SOT223 solutions are replaced with the ZXMS6004FF.
Typical applications include motor control, lamp driver, solenoid driver, automotive, linear mode systems, resistive / inductive / capacitive loads in switching applications, loads with a high in-rush current such as lamps and motors, says the company.
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