Advanced Thermal Solutions product news
Results 1 - 4 of 4-
ATS – Fast secure mounting of heat sinks to flip chips, BGAs and other hot PCB components
Advanced Thermal Solutions (ATS) has expanded its line of maxiGRIP attachment systems for fast, secure mounting of heat sinks to flip chips, BGAs ...
Apr 24 2013 - Subs & Systems [More Electronics Subs & Systems Articles] -
Advanced Thermal – Versatile new heat sinks feature convenient push pin mounting system
A new series of its maxiFLOW heat sinks, with a convenient integral push pin mounting system, has been introduced by Advanced Thermal Solutions, for ...
Jul 22 2011 - Design & Manufacture [More Electronics Design & Manufacture Articles] -
Advanced Thermal – New lower height heat sinks for tight packaging conditions
A new line of lower height 'maxiFLOW' heat sinks, for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions, ...
Jan 15 2010 - Subs & Systems [More Electronics Subs & Systems Articles] -
ATS – Two new heat sink solutions for cooling Freescale processors
Two new heat sink solutions for cooling Freescale Semiconductor's MPC8641D Dual-Core PowerPC Processors, are being introduced by Advanced Thermal ...
Jul 25 2006 - Design & Manufacture [More Electronics Design & Manufacture Articles]








