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Results 31 - 40 of 42
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 | Samtec - IP68 sealed circular I/O interfaces for harsh environments
New 'Acclimate' sealed circular interfaces, which meet IP68 specifications
for dust and waterproof sealing in industrial or other rugged/harsh
environment applications, are now available from Samtec. The initial
offering includes interfaces for E...
Jun 28 2006 |
 | Samtec - Signal-integrity design guide offers end-to-end interconnect solutions
Offering end-to-end solutions for panel-to-panel, panel-to-board,
cable-to-board and board-to-board applications - as well as signal integrity
design resources including PCB design tools - Samtec has published the
Signal Integrity Interconnect Des...
Jun 26 2006 |
 | Samtec - New differential pair Arrays maximize bandwidth per square inch
New differential pair arrays, which maximize bandwidth per square inch of
board area with performance of up to a terabit per connector, with up to 168
usable signal pairs, have been introduced by Samtec. The DPAM/DPAF Series
signal pairs are on a...
Apr 10 2006 |
 | Samtec - New catalogue feature wide ranges of interconnect systems
With 350 pages of applications, specifications, and ordering information on
panel-to-panel, panel-to-board, cable-to-board, and board-to-board
interconnect systems, Samtec has released its new F-206 full line catalogue.
Applications are detailed b...
Mar 30 2006 |
 | Samtec - High-density interconnect arrays have added features
New high-density interconnects which provide a solid grid of contacts on
(1.27mm) pitch, and up to 500 I/Os, have been introduced by Samtec. The
SEARAY SEAM/SEAF Series connectors are the same footprint as the popular
SamArray Series connector, b...
Feb 24 2006 |
 | Samtec - Design guide offers signal integrity at any distance
Detailed in a new interconnect design and signal integrity services guide,
Samtec details its ability to provide 'Signal Integrity at Any Distance'.
The guide includes end-to-end solutions for panel-to-panel, panel-to-board,
cable-to-board, and bo...
Dec 15 2005 |
 | Samtec - High-performance contacts for rugged interfaces
Multi-finger precision stamped and formed, Tiger Eye contacts, from Samtec,
are Beryllium Copper contacts that are heat-treated to optimize spring
properties for maximum cycles in high-reliability applications.
The contacts are available in 1.27...
Nov 17 2005 |
 | Samtec - Micro pitch interconnects save board area
A range of sub-millimetre micro pitch interfaces is now available, from
Samtec. They are avail;able in 0.5mm, 0.635mm, and 0.8mm pitch and provide
space and cost savings along with the proven performance features of
traditional blade and beam cons...
Aug 30 2005 |
 | Samtec - Industry-leading automotive interconnect solutions
A comprehensive automotive interconnect solutions guide has been published
by Samtec. Areas covered include Rugged, Power, Cable Plugs and
Receptacles, Discrete Wire Systems, Micro and Standard Board-to-Board
Interconnects, Micro Card Interfaces,...
Aug 25 2005 |
 | Design guide details rugged interface capabilities
A complete range of rugged interface capabilities, from I/O interfaces 'outside the box' to board level interconnects 'inside the box' are detailed in a new design guide, from Samtec.
Panel-to-Panel and Panel-to-Board interfaces include AccliMATE...
Jul 25 2005 |
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