Rugged new SMT headers expand high-reliability connection system

With the introduction of a new surface mount-version of its right-angle header, Molex has extended its high-speed HSAutolink connection system offering an additional mounting option for manufacturing process optimisation. The ruggedised, industry-standard USCAR-30 header meets all USB2.0, LVDS (Low-Voltage Differential Signalling) and Ethernet BroadR-Reach electrical and EMI shielding requirements for the connected vehicle segment in automotive and commercial vehicle applications. “The one-piece design of the header ensures high integrity and robustness of the connector interface,” said Laurent Stickeir, global product manager, Molex, “While the high-temperature-rated plastic housing safeguards all the internals during lead-free, reflow soldering.” Innovative side ribs on the housing provide assured PCB stabilisation during one-step processing, which facilitates manufacturing process efficiency further. The flexible packaging options, both rigid tray and tape and reel, support fully-automated assembly. Several colour-coded keying options are also available.