Bomar has announced the addition of high-density BNC connectors to its E-Snap Series of edgeboard RF connectors. The new 75ohm interconnects are 51% smaller than traditional BNC devices, permitting four times the density, and 40% smaller than the DIN 1.0/2.3.

Their small form factor allows engineers to design more connections into less space while maintaining the stringent performance and reliability characteristics required by the broadcast industry. Moreover, as they feature proprietary E-Snap technology whereby they are manufactured with small protrusions inside their PCB slots, they ‘snap’ and lock securely into solder-pasted holes when they are mounted to the PCB.

Since they are held securely in place prior to reflow soldering, strain on the solder joint is significantly reduced, which facilitates the industry’s most durable mount to the PC board. E-Snap technology notably enables OEMs to maximize throughput while reducing the time and expenses related to applying adhesives. Additionally, end launch mounting allows for optimal return loss capabilities and VSWR.

Rated for use in 3G applications, the rugged HDBNC E-Snap interconnects are suitable for employment in an array of high bandwidth connections in broadcast and digital video-HDTV applications. They are also appropriate for connections in video network routing and switching, and in any application in which standard BNC connectors may be used.

The high density BNC E-Snaps, along with Bomar’s entire E-Snap Series, meet or exceed all industry mechanical, electrical and environmental standards. To further ensure the utmost in reliability, E-Snap connectors offer a straight-through contact design and gold-plated contacts. The high-density BNCs fit traditional miniature broadcast cables and offer a frequency range of 0-4GHZ. Parts are supplied in male or female versions and, while gold is the standard, they are also offered in a variety of standard- and custom-plating alternatives, says the company.

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