Maxim – New 40G chipset reduces power consumption and boosts data centre throughput (MAX3948)

Maxim Integrated Products has announced a 40G transmitter chipset that provides data centres with 4x the data throughput, at very low power, and in little more space than conventional single-channel alternatives. The new 4-channel 40GBASE-LR4 QSFP+ chipset comprises the MAX3948 DC-coupled laser driver and the DS4830 optical microcontroller.

Data centres and data communication networks need to significantly increase data density while staying within their already constrained power budgets. The new QSFP+ transmitter solution addresses both challenges. The QSFP+ modules supply 4x the data throughput in only 1.5x the area of a single-channel SFP+ solution. Equally important, Maxim’s chipset enables 4 x 10Gbps QSFP+ modules to consume less power per channel than single SFP+ modules. Service providers and network operators can now enjoy the benefits of a low-power solution that extends system life, reduces operational expense, and conserves valuable energy resources.

MAX3948 Key Advantages: * Consumes less than 2W for 4 transmit channels, enabling less than 3.5W QSFP+ module power consumption. * DC-coupled laser interface (patent-pending, application number 13/352,011) reduces power consumption and external component count.

DS4830 Key Advantages: * On-chip 13-bit ADC with dedicated round-robin offloads 16-bit microcontroller core and lowers clock speed; saves 75mW to 100mW compared to competitive solutions. * Single-cycle multiply accumulator (MAC) allows DS4830 to speed through filter calculations and easily maintain four average power control (APC) loops.

“Power consumption has emerged as the single most critical constraint in today’s data centre,” said Karen Liu, principal analyst, Ovum. “It limits density and performance which, in turn, determine cost. Maxim’s chip innovation tackles this key problem.”

Dr. Andrew Carat, senior business manager, Maxim Integrated Products, said: “The MAX3948 and DS4830 demonstrate Maxim’s innovative approach to integration. This chipset resolves power-density limitations in data-centre interconnects by utilizing DC coupling to the laser,” said. “This transmitter solution meets all QSFP+ requirements and provides minimum power dissipation.”

The MAX3948 device is available in a 3mm x 3mm, 16-pin TQFN package and specified for the -40C to +95C temperature range. The DS4830 is available in a 5mm x 5mm, 40-pin TQFN package, says the company.