Intertronics – New electrically conductive adhesive for chip and substrate bonding (EC101)

Polytec PT EC101, from Intertronics, is a new two-component, silver filled, electrically conductive epoxy for chip and substrate bonding. Applications include micro-electronics, hybrid circuits, optoelectronics, LED and photovoltaic applications on ITO, TCO, metals, glass, Si, ceramic and most plastics. It can be cured below 100C and still have a volume resistivity of 1-2 x 10^-3ohm-cm. The chemistry of the epoxy also allows rapid cure cycles at higher temperatures. Because of its USP Class VI biocompatibility certification, it will have special interest to those manufacturing disposable medical devices, says the company.

The EC101 features fast curing (60 minutes at 95C to 40 seconds at 180C), a pot life at room temperature of two days, pH value of 8.5 and high temperature stability in service (-55C to +200C continuous to +300C intermittent).

Many pack options are available, including pre-mixed and frozen, and specialised dispensing support is provided by the engineers at Intertronics regarding syringes, screen print, jet-dispensing or fast and easy manual application, e.g. for circuit repairs, says the company.