Design & Manufacture
Laird Technologies – New thermoelectric modules provide precise temperature stabilization (eTEC Series)Jul 12 2012 - Design & Manufacture [More Design & Manufacture Articles]
Laird Technologies has announced the release of its eTEC Series thermoelectric module (TEM) product line.
The eTEC Series of TEMs enable high-powered optoelectronics to maintain peak performance by stabilizing the temperature of the device during operation. The modules are assembled using thin-film technology that enables the TEMs to have ten times the heat pumping density per unit area than conventional bulk thermoelectric technology. The ceramic substrates are gold metallized to allow the product to be embedded into densely packed optoelectronics, says the company.
“As next generation packaging shrinks in size, conventional bulk technology becomes more of a design constraint due to its large package size,” said Andrew Dereka, product manager, Laird Technologies. “Thin film technology provides our customers with more flexibility to optimize package design and keep optics stable in temperature fluctuating environments.”
The thin film eTEC TEMs have heat pumping densities ranging from 75 to 90W/cm2 at an ambient temperature of 25C. The new models include: • HV14,18,F0,0101,GG – 1.4W in 1 mm2 • HV37,48,F2,0202,GG – 3.7W in 6.9 mm2 • HV56,72,F2,0203,GG – 4.8W in 10.2 mm2Electropages - Electronics Components News, From Leading Electronics Distributors. More news from Laird