Design & Manufacture
Digi-Key – High-performance silicone-free thermally-conductive gap filler (Laird - Tflex - SF600)Jul 27 2012 - Design & Manufacture [More Design & Manufacture Articles]
Laird Technologies’ high-performance Tflex SF600 DF gap filler is now available from Digi-Key. It is a silicone-free thermal gap filler with a conductivity of 2.8 – 3W/mK. Tflex SF600 DF is designed for applications which are silicone sensitive. The material is certified to UL 94V0 flammability ratings.
Typical applications include automotive, optical components, flat-panel displays and hard drives.Electropages - Electronics Components News, From Leading Electronics Distributors. More news from Digikey