NXP – Compact ‘benchmark’ low VF Schottky rectifiers target mobile device applications (NXP DFN1608D-2 Schottky rectifiers)

Feb 3 2012 - Power [More Power Articles]

Announced a major new benchmark in miniaturization, the launch of its next-generation family of low VF Schottky rectifiers aimed at the mobile device market, has been announced by NXP Semiconductors.

The new DFN1608D-2 (SOD1608) is ultra-thin, with a thickness of just 0.37mm it is the smallest plastic package on the market and is capable of carrying a current of up to 1.5A. Offering significant space saving options, the chip reduces power consumption and enables longer battery life in mobile devices, says the company.

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