Universal Instruments – Linear motor driven

The launch of its latest Platform placement system, the AdVantis XS, has been announced by Universal Instruments.

Designed specifically for the convergence of semiconductor and standard surface-mount assembly, the new system deploys the company´s innovative VRM linear motors for exceptional accuracy and repeatability.

AdVantis XS is the natural evolution of the company’s acclaimed GSMxs, delivering similar accuracies of +/-9 microns at +/- 3 sigma, but with a 25% increase in feeder capacity for greater on-machine inventory and a 15% speed improvement. At the same time, the advanced materials engineering and optimized design of the AdVantis platform offers users a highly competitive price some 25% lower than its predecessor, while the company´s platform philosophy ensures high levels of backward compatibility, shared resources and common interfaces – even extending to its GSM Genesis platform range.

“Overall, our studies demonstrate that AdVantis XS can cut cost of ownership by 40% which, in turn, reduces cost-per-placement in the competitive flip chip market segment,” said Richard Boulanger, vice president of the Advanced Semiconductor Assembly division at Universal Instruments. “It provides a lower-cost alternative sought by those in low-margin assembly applications who still require high accuracy placement of flip chip and other advanced packages without sacrificing Universal’s time-honored platform strengths – robustness, modularity and scalability – all backed by superior expertise and support.”

The new linear-motor-driven AdVantis XS delivers all the capability and functionality demanded by high-end assembly including high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. It is also Class 1000 clean room compatible.

“Leveraging Universal’s credentials as a pioneer of leading-edge placement platforms, the high accuracy AdVantis XS extends equipment capabilities into System-In-Package (SiP) assembly,” added Boulanger.